Photolithographic Capability

CTS is capable of single and double side fine line metallization with excellent metal adhesion to ceramic.  Capabilities include:

Resolution capability:	(+/-) 2 microns
Registration capability:	(+/-) 2 microns
Top to bottom alignment registration capability:	(+/-) 2 microns
Wafer size capabilities:
Circular wafers:	1 to 6 inches in diameter
Rectangular wafers:	Varied with a maximum of 6 inches x 4 inches
Square wafers:	1 to 6 inches square
Top Contact Metallization:	Gold on NiChrome

Critical dimension measurement capability.

Contact us for further details or inquires.