Electronics Manufacturing Solutions (EMS)
EMS Products and Services > Backplane Technology & Assembly

BACKPLANE TECHNOLOGY & ASSEMBLY

"Backplane technology lies at the heart of CTS’ capabilities – we are one of the largest independent custom providers of press-fit & surface mount backplanes and have over 15 years’ experience in their design and manufacture."

BACKPLANE ASSEMBLY – EXPERIENCE MATTERS.

We recognize that backplane production is not the easiest to get right – over 15 years we have worked to build a core team of engineering, production and support expertise at each of our facilities to deliver cost efficient backplane solutions to customers.

CTS works with some of the largest and smallest OEMs in the technology sector to provide flexible, reliable board assemblies – from simple 8-layer boards to the high-density, high-speed 48-layer backplanes required by the technology-driven communications sector. All of our facilities are controlled under ISO9001:2000 and several have market specific accreditations such as ISO13485:2003 and AS9100.

SERVICES

• Design, layout and simulation of custom backplane assemblies
• Design-for-Manufacture (DFM) and Design-for-Test (DFT) capabilities
• Design to industry specification – members of major industry backplane groups
• High-speed, high-density, complex board assembly
• CTS in-house connector ranges for cost & lead-time efficiency
• Best-in-class supplier partnerships in all major regions for best PCB solution
• Specialist capabilities – IPC Class II and III, in-house conformal coating
• Engineering support & program management resource in all locations
• Hi-node count testing
• Ability to add value through full system integration

BENEFITS

• GLOBAL DESIGN & LAYOUT CAPABILITIES
• DEDICATED NPI TEAMS FOR RAPID TIME-TO-MARKET
• EXPERIENCE & TECHNOLOGY EXPERTISE – SPECIFIC TO BACKPLANES
• FLEXIBLE MANUFACTURING OPTIONS – BATCH RUNS TO HIGH VOLUME / MULTI-REGION

TECHNOLOGIES

Materials:

• FR4
• HiTgFR4
• Nelco 4000 (full range)
• Getek
• Megtron
• Rogers (including FR4 hybrids)
• FR406 & FR408 high performance epoxy laminate
• Polymide / Flex
• 'Halogen free' materials & solder masks

Board Geometry:

1. 2cm - <1.5m length (1” to 60”)
2. <9.5mm (<0.375”)
3. <56 Layers

Finishes:

• HASL
• Immersion Tin
• Electroless Gold
• Electroless Silver
• OSP
• White Sun

Standard Clean / No Clean Materials

Conductive Materials

In-House Conformal Coating

Buried & Blind Vias

Controlled Impedance +/-7.5%