Precision Machining

CTS is capable of precision dicing with our automated wafer dicing systems that consistently meet the tight requirements expected in the industry and demanded by our customers. A wide variety of shapes and dimensions can be achieved with dicing. Contact us for further details or inquires.

CTS HD PZT with diced slots that are 20 mils (500 um) deep, 4 mils (100 um) wide with 2 mil (50 um) walls

CTS provides edge beveling for improved metal continuity or metal isolation. Contact us for further details or inquires.

CTS HD PZT with a 45º bevel along length of wafer

CTS is capable of providing lapped to thickness wafers as thin as 0.0047” while maintaining tolerances as tight as 0.0002" using double-sided lapping machines. We currently offer surface finishes from 900Å Ra to 8000Å Ra. Contact us for further details or inquires.

CTS is capable of backside grinding to dimensions as thin as 60 microns (0.00236”) while maintaining tolerances as tight as ±3 microns (0.00012”). We currently offer surface finishes from 900Å Ra to 8000Å Ra. Contact us for further details or inquiries.

CTS' high volume wire saws are capable of producing wafers as thin as 0.005".  Contact us for further details or inquires.