Heatsinks
CTS has designed and engineered a wide range of efficient heatsinks for electronic device, circuit, and system thermal management applications. These heatsinks are available in a variety of formats, including extruded, precision forged, and stamped units. Heatsinks can be supplied in standard horizontal or vertical mounting to circuit boards or other heat sources with a choice of round pin fins or elliptical fins for effective heat dispersion, and in compact clip mounted BGA formats to “beat the heat” while maintaining small design dimensions. Heatsinks can also be supplied as RoHS-compliant units in a variety of sizes and configurations.
Fan Heat Sinks
High Temp Fan Heatsinks
Adhesive Peel and Stick Heat Sinks
Adhesive Peel and Stick Heat Sinks – Part Number Series: BDN
Extruded Heatsinks for Power Transistors
Extruded Heatsinks for Power Transistors
Forged Heatsinks with Plate Fins
Forged Heatsinks APF AER Series
Pin Fin Configuration
Pin Fin Configuration – Part Number Series: APR
Clip Styles for Forged Heatsinks
Clip Styles for Forged Heatsinks
Thermal Links for TO-5, TO-8 and TO-18 Transistors
Thermal Links for TO-5, TO-8 and TO-18 Transistors
Stamped Heatsinks for Power Transistors
Stamped Heatsinks for Power Transistors