CTS offers high-performance piezoelectric materials for a wide range of applications, including for bimorphs, high-frequency sensors, transducers, and MEMS devices. Available in a variety of material compositions including in standard-density (97%) and high-density (>99.5%) formulations, these piezoelectric materials can be produced in large-format wafers in large quantities to support the highest-volume production applications.
Our PiezoPower™ piezoelectric materials are mechanically and electrically consistent across each wafer and from wafer to wafer, ensuring that the performance of components from large production runs will be consistent and reliable. A wide range of material wafer sizes is available, with diameters as large as 6.00 in. and as thin as 40 μm thick for compatibility with the latest monolithic and integrated-circuit (IC) technologies
In support of its versatile PiezoPower piezoelectric materials, we also offer extensive value-added manufacturing services and design, development and engineering supports to assist customers in the most cost-effective applications of their piezoelectric materials possible. These additional services include wafer photolithography, precision machining, packaging, and testing.