CTS has designed and engineered a wide range of efficient heatsinks for electronic devices, circuit, and system thermal management applications. These heatsinks are available in a variety of formats, including extruded, precision forged, and stamped units.
Heatsinks can be supplied in standard horizontal or vertical mounting to circuit boards or other heat sources with a choice of round pin fins or elliptical fins for effective heat dispersion, and in compact clip-mounted BGA formats to “beat the heat” while maintaining small design dimensions. Heatsinks can also be supplied as RoHS-compliant units in a variety of sizes and configurations.
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CTS components are stocked and sold through a global network of distributors & sales representatives. Select your preferred partner in the link below.
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